Yamaha YAS532B 3-Axis Geomagnetic Compass Reverse Costing - KTUL.com - Tulsa, Oklahoma - News, Weather & Sports

Yamaha YAS532B 3-Axis Geomagnetic Compass Reverse Costing

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SOURCE Research and Markets

DUBLIN, February 6, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/8sj9jg/yamaha_yas532b) has announced the addition of the "Yamaha YAS532B 3-Axis Geomagnetic Compass Reverse Costing" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


More than 6 years after the release of its first electronic Compass for consumer applications, Yamaha has released its third 3-Axis geomagnetic sensor.

In a market largely dominated by AKM, Yamaha has launched its new very small eCompass, 1.46mm x 1.46mm, based on a GMR principle, in order to gain market shares. The manufacturing process combines GMR deposition and surface micromachining , allowing to measure the 3-axis with one die. The YAS532B has the same performances that the new AKM device with an area 17% smaller.

Manufactured in a old foundry amortized, the YAS532B is very cheap.

The YAS532B integrates an ingenious magnetic concentrator.

This report provides a complete teardown of the 3-axis Geomagnetic Compass with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Selling price estimation


Key Topics Covered:

Glossary

1. Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

2. Company Profile

  • Yamaha
  • YAS532B Characteristics

3. Physical Analysis

  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package
  • Package Views & Dimensions
  • Package Pin Out
  • Package Opening
  • Package Cross-Section
  • Protection Layer
  • Sensor
  • View & Dimensions
  • Marking
  • Sensing Area
  • X-axis GMR Elements
  • GMR Principle
  • Y and Z-axis Elements
  • Sensor Bond Pad Cross-Section
  • Sensor Layers Cross-Section
  • Process Characteristics
  • ASIC Die
  • View & Dimensions
  • Marking
  • Delayering
  • Cross-Section
  • Process Characteristics

4. Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

5. Cost Analysis

  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per process steps
  • MEMS Front-End: Equipment Cost per Family
  • MEMS Front-End: Material Cost per Family
  • Probe Test Cost
  • Wafer Level Packaging Wafer Cost
  • Final Test & Calibration Cost
  • Component Die Cost

6. Estimated Price Analysis

  • Definition of Prices
  • Manufacturer Financial Ratios
  • Estimated Manufacturer Price
  • Estimated Selling Price

Contact

For more information visit http://www.researchandmarkets.com/research/8sj9jg/yamaha_yas532b


Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net


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